NXP Semiconductors 74F219AD Technology: TTL Package Shape: RECTANGULAR Package Style: SMALL OUTLINE Surface Mount: Yes Terminal Form: GULL WING Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 16 Package Body Material: PLASTIC/EPOXY Temperature Grade: COMMERCIAL Memory Width: 4 Organization: 16 X 4 Memory Density: 64 deg Operating Mode: ASYNCHRONOUS Number of Words: 16 words Number of Words Code: 16 Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 5.5 V Supply Voltage-Min (Vsup): 4.5 V Supply Voltage-Nom (Vsup): 5 V Memory IC Type: STANDARD SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 8 ns